The rate equation for the dissolution of silica in hydrochloric-hydrofluoric acid mixtures
J. Chim. Phys., 76 (1979) 538-544
Published online: 2017-05-29
Articles citing this article
The Citing articles tool gives a list of articles citing the current article.
The citing articles come from EDP Sciences database, as well as other publishers participating in CrossRef Cited-by Linking Program. You can set up your personal account to receive an email alert each time this article is cited by a new article (see the menu on the right-hand side of the abstract page).
Cited article:
This article has been cited by the following article(s):
Study of Wet Surface Activation Routes to Enable the Deposition of Monomolecular Organic Thin Films on k 2.0 Porous Dielectrics
S. Armini, J. Loyo Prado, M. Krishtab, et al.ECS Journal of Solid State Science and Technology 3 (1) N3106 (2014)
https://doi.org/10.1149/2.017401jss
Surface Chemical Reaction Model of Silicon Dioxide Film Etching by Dilute Hydrogen Fluoride Using a Single Wafer Wet Etcher
Hitoshi Habuka, Kosuke Mizuno, Shintaro Ohashi and Tetsuo KinoshitaECS Journal of Solid State Science and Technology 2 (6) P264 (2013)
https://doi.org/10.1149/2.013306jss
129 (2012)
https://doi.org/10.1002/9781119963677.ch4
${\rm SiO}_{2}$ Etching With Aqueous HF: Design and Development of a Laboratory-Scale Integrated Wet Etch/Dry Reactor
Ashish A. Pande, David S. L. Mui and Dennis W. HessIEEE Transactions on Semiconductor Manufacturing 24 (1) 104 (2011)
https://doi.org/10.1109/TSM.2010.2085457
Effect of Chemical Solutions and Surface Wettability on the Stability of Advanced Porous Low-k Materials
Q. T. Le, G. Vereecke, A. Bertha, et al.MRS Proceedings 1335 (2011)
https://doi.org/10.1557/opl.2011.1228
Development of rollable silicon thin‐film‐transistor backplanes utilizing a roll‐to‐roll continuous lamination process
Kazushige Takechi, Shinya Yamaguchi, Hiroshi Tanabe and Setsuo KanekoJournal of the Society for Information Display 18 (6) 391 (2010)
https://doi.org/10.1889/JSID18.6.391
Transfer Processes for Thermally Stable Large-Size TFT Flexible Substrates
Kazushige Takechi, Toshimasa Eguchi, Hiroshi Kanoh, Kenichi Kanemasa and Shigeyoshi OtsukiIEEE Transactions on Semiconductor Manufacturing 20 (1) 20 (2007)
https://doi.org/10.1109/TSM.2007.890771
High-Rate Glass Etching Process for Transferring Polycrystalline Silicon Thin-Film Transistors to Flexible Substrates
K. Takechi, T. Eguchi, H. Kanoh, T. Ito and S. OtsukiIEEE Transactions on Semiconductor Manufacturing 18 (3) 384 (2005)
https://doi.org/10.1109/TSM.2005.852102
Removal of Plasma-Modified Low-k Layer Using Dilute HF: Influence of Concentration
Quoc Toan Le, M. R. Baklanov, E. Kesters, et al.Electrochemical and Solid-State Letters 8 (7) F21 (2005)
https://doi.org/10.1149/1.1928234
Etching Mechanism of Vitreous Silicon Dioxide in HF-Based Solutions
D. Martin KnotterJournal of the American Chemical Society 122 (18) 4345 (2000)
https://doi.org/10.1021/ja993803z
Chemical Attack in Free Boundary Domains
S. ClainJournal of Applied Analysis 5 (1) 35 (1999)
https://doi.org/10.1515/JAA.1999.35
Silicon dioxide sacrificial layer etching in surface micromachining
J Bühler, F-P Steiner and H BaltesJournal of Micromechanics and Microengineering 7 (1) R1 (1997)
https://doi.org/10.1088/0960-1317/7/1/001
A review of the chemical reaction mechanism and kinetics for hydrofluoric acid etching of silicon dioxide for surface micromachining applications
David J. Monk, David S. Soane and Roger T. HoweThin Solid Films 232 (1) 1 (1993)
https://doi.org/10.1016/0040-6090(93)90752-B
Wet chemical etching of silicate glasses in hydrofluoric acid based solutions
G. A. C. M. SpieringsJournal of Materials Science 28 (23) 6261 (1993)
https://doi.org/10.1007/BF01352182
LPCVD Silicon Dioxide Sacrificial Layer Etching for Surface Micromachining
David J. Monk, David S. Soane and Roger T. HoweMRS Proceedings 276 (1992)
https://doi.org/10.1557/PROC-276-303
The etching of Ti-W in concetrated H2O2 solutions
J.E.A.M. van den Meerakker, M. Scholten and J.J. van OekelThin Solid Films 208 (2) 237 (1992)
https://doi.org/10.1016/0040-6090(92)90649-V
Characterization of the crystallinity of silicates by dissolution conductimetry
M. Murat and M. DrioucheJournal of the European Ceramic Society 6 (2) 73 (1990)
https://doi.org/10.1016/0955-2219(90)90039-I
The dissolution kinetics of quartz as a function of pH and time at 70°C
Kevin G. Knauss and Thomas J. WoleryGeochimica et Cosmochimica Acta 52 (1) 43 (1988)
https://doi.org/10.1016/0016-7037(88)90055-5
Dissolution Kinetics of TiO2 in HF‐HC1 Solutions
ERIC BRIGHT and DENNIS W. READEYJournal of the American Ceramic Society 70 (12) 900 (1987)
https://doi.org/10.1111/j.1151-2916.1987.tb04914.x
Dissolution Kinetics of Crystalline and Amorphous Silica in Hydrofluoric‐Hydrochloric Acid Mixtures
DA‐TUNG LIANG and DENNIS W. READEYJournal of the American Ceramic Society 70 (8) 570 (1987)
https://doi.org/10.1111/j.1151-2916.1987.tb05708.x
The dissolution of Na2O-MgO-CaO-SiO2 glass in aqueous HF solutions
G. A. C. M. Spierings and J. van DijkJournal of Materials Science 22 (5) 1869 (1987)
https://doi.org/10.1007/BF01132419
Effect of asbestos fibers on aryl hydrocarbon hydroxylase and aminopyrine N-demethylase activities of rat liver microsomes
Chithan Kandaswami, Masuma Rahimtula and Peter J. O'BrienToxicology 38 (1) 119 (1986)
https://doi.org/10.1016/0300-483X(86)90177-0
Fluoride-based etchants for quartz
J. K. VondelingJournal of Materials Science 18 (1) 304 (1983)
https://doi.org/10.1007/BF00543840
ChemInform Abstract: THE RATE EQUATION FOR THE DISSOLUTION OF SILICA IN HYDROCHLORIC‐HYDROFLUORIC ACID MIXTURES
H. H. BORN and M. PRIGOGINEChemischer Informationsdienst 11 (3) (1980)
https://doi.org/10.1002/chin.198003011